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«Background Statement for SEMI Draft Document 4683A Line Item Revisions to SEMI S2-0310e, ENVIRONMENTAL, HEALTH, AND SAFETY GUIDELINE FOR ...»

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Background Statement for SEMI Draft Document 4683A

Line Item Revisions to SEMI S2-0310e, ENVIRONMENTAL, HEALTH,

AND SAFETY GUIDELINE FOR SEMICONDUCTOR MANUFACTURING

EQUIPMENT

(In Delayed Effective Date Format)

Notice: This background statement is not part of the balloted item. It is provided solely to assist the recipient in

reaching an informed decision based on the rationale of the activity that preceded the creation of this Document.

Notice: Recipients of this Document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided.

Background Statement This task force was chartered to clarify and review industrial hygiene criteria in 23.5. The section has added explanatory materials for valid air sampling and measurement methods and accredited laboratories. Additionally, conformance criteria statements have been clarified.

This ballot consists of three line items:

Line Item 1: Chemical Exposure Criteria Line Item 2: OEL Clarification Line Item 3: Change to applied OEL percentage for normal, maintenance, and fault conditions Please forward a courtesy copy of any comments or negatives against the ballot with your contact information to John Visty at john.visty@salusengineering.com. As this is a technical ballot, all votes of reject must be accompanied by negatives and sent to SEMI staff or they will be considered abstention votes.

Review and Adjudication Information Task Force Review Committee Adjudication S2 Chemical Exposure TF NA EHS Committee

Group:

Monday, July 9, 2012 (tentative) Thursday, July 12, 2012

Date:

2:00 PM to 3:30 PM (tentative) 9:00 AM to 6:00 PM

Time & Timezone:

US Pacific Time US Pacific Time San Francisco Marriott Marquis Hotel San Francisco Marriott Marquis Hotel

Location:

55 Fourth Street 55 Fourth Street San Francisco, CA 94103 / USA San Francisco, CA 94103 / USA

City, State/Country:

John Visty (Salus) Chris Evanston (Salus)

Leader(s):

Sean Larsen (Lam Research AG) Eric Sklar (Safety Guru, LLC) Paul Trio (SEMI NA)

–  –  –

Telephone and web information will be distributed to interested parties as the meeting date approaches. If you will not be able to attend these meetings in person but would like to participate by telephone/web, please contact Standards staff.

Safety Checklist for SEMI Draft Document #4683A Line Item Revisions to SEMI S2-0310e, ENVIRONMENTAL, HEALTH,

AND SAFETY GUIDELINE FOR SEMICONDUCTOR MANUFACTURING

EQUIPMENT

Developing/Revising Body S2 Chemical Exposure Task Force

Name/Type:

Environmental, Health and Safety

Technical Committee:

North America

Region:

–  –  –

Documents, Conflicts, and Consideration Safety related codes, standards, and practices used in developing the safety guideline, and the manner in which each item was considered by the technical committee # and Title Manner of Consideration SEMI S6-0707 – EHS Guideline for Exhaust Ventilation Align criteria and terminology of Semiconductor Manufacturing Equipment

–  –  –

Other conflicts with known codes, standards, and practices or with commonly accepted safety and health principles to the extent practical # and Title Nature of Conflict with This Safety Guideline NONE

–  –  –

1 Purpose

1.1 This Safety Guideline is intended as a set of performance-based environmental, health, and safety (EHS) considerations for semiconductor manufacturing equipment.

2 Scope NOTICE: Revisions to § 2 will be effective upon the July 2012 publication as shown in Delayed Revisions Sections 6 and 7. The global Environmental Health & Safety Technical Committee has voted that the revisions are OPTIONAL before the Effective Date.

2.1 Applicability — This guideline applies to equipment used to manufacture, measure, assemble, and test semiconductor products.

2.2 Contents — This Document contains the following sections:

1. Purpose

2. Scope

3. Limitations

4. Referenced Standards and Documents

5. Terminology

6. Safety Philosophy

7. General Provisions

8. Evaluation Process

9. Documents Provided to User

10. Hazard Warning Labels

11. Safety Interlock Systems

12. Emergency Shutdown

13. Electrical Design

14. Fire Protection

15. Heated Chemical Baths

16. Ergonomics and Human Factors

17. Hazardous Energy Isolation

18. Mechanical Design

19. Seismic Protection

20. Automated Material Handlers





21. Environmental Considerations

–  –  –

22. Exhaust Ventilation

LETTER (YELLOW) BALLOT

23. Chemicals

24. Ionizing Radiation

25. Non-Ionizing Radiation and Fields

26. Lasers

27. Sound Pressure Level

28. Related Documents Appendix 1 — Enclosure Openings Appendix 2 — Design Guidelines for Equipment Using Liquid Chemicals Appendix 3 — Ionizing Radiation Test Validation Appendix 4 — Non-Ionizing Radiation (Other than Laser) and Fields Test Validation Appendix 5 — Fire Protection: Flowchart for Selecting Materials of Construction Appendix 6 — Laser Data Sheet – SEMI S2

2.3 Precedence of Sectional Requirements — In the case of conflict between provisions in different sections of this guideline, the section or subsection specifically addressing the technical issue takes precedence over the more general section or subsection.

NOTICE: SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their use. It is the responsibility of the users of the Documents to establish appropriate safety and health practices, and determine the applicability of regulatory or other limitations prior to use.

3 Limitations

3.1 This guideline is intended for use by supplier and user as a reference for EHS considerations. It is not intended to be used to verify compliance with local regulatory requirements.

3.2 It is not the philosophy of this guideline to provide all of the detailed EHS design criteria that may be applied to semiconductor manufacturing equipment. This guideline provides industry-specific criteria, and refers to some of the many international codes, regulations, standards, and specifications that should be considered when designing semiconductor manufacturing equipment.

3.3 Existing models and subsystems should continue to meet the provisions of SEMI S2-93A. Models with redesigns that significantly affect the EHS aspects of the equipment should conform to the latest version of SEMI S2.

This guideline is not intended to be applied retroactively.

3.4 In many cases, references to standards have been incorporated into this guideline. These references do not imply applicability of the entire standards, but only of the sections referenced.

4 Referenced Standards and Documents

4.1 SEMI Standards and Safety Guidelines SEMI E6 — Guide for Semiconductor Equipment Installation Documentation SEMI F5 — Guide for Gaseous Effluent Handling SEMI F14 — Guide for the Design of Gas Source Equipment Enclosures SEMI F15 — Test Method (SF6 Tracer Gas) for Enclosures Has Been Moved to SEMI S6 SEMI S1 — Safety Guideline for Equipment Safety Labels SEMI S3 — Safety Guideline for Process Liquid Heating System SEMI S6 — EHS Guideline for Exhaust Ventilation of Semiconductor Manufacturing Equipment

–  –  –

SEMI S7 — Safety Guidelines for Environmental, Safety, and Health (ESH) Evaluation of Semiconductor

LETTER (YELLOW) BALLOT

Manufacturing Equipment SEMI S8 — Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment SEMI S10 — Safety Guideline for Risk Assessment and Risk Evaluation Process SEMI S12 — Guidelines for Equipment Decontamination SEMI S13 — Environmental, Health and Safety Guideline for Documents Provided to the Equipment User for Use with Semiconductor Manufacturing Equipment SEMI S14 — Safety Guidelines for Fire Risk Assessment and Mitigation for Semiconductor Manufacturing Equipment SEMI S22 — Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment

4.2 ANSI Standards1 ANSI/IEEE C95.1 — Standard for Safety Levels with Respect to Human Exposure to Radio Frequency Electromagnetic Fields, 3 kHz to 300 GHz ANSI/RIA R15.06 — Industrial Robots and Robot Systems – Safety Requirements ANSI/ISA S84.01 — Application of Safety Instrumented Systems for the Process Industry

4.3 CEN/CENELEC Standards2 CEN EN 775 — Manipulating Industrial Robots – Safety CEN EN 1050 — Safety of Machinery – Principles of Risk Assessment CEN EN 1127-1 — Explosive Atmospheres – Explosion Prevention and Protection – Part 1: Basic Concepts and Methodology

4.4 DIN Standards3 DIN V VDE 0801 — Principles for Computers in Safety-Related Systems

4.5 IEC Standards4 IEC 60825-1 — Safety of Laser Products – Part 1: Equipment Classification, Requirements IEC 61010-1 — Safety Requirements for Electrical Equipment for Measurement, Control, and Laboratory Use – Part 1: General Requirements IEC 61508 — Functional Safety of Electrical/Electronic/Programmable Electronic Safety-Related Systems

4.6 ISO Standards5 ISO 10218-1 — Robots for Industrial Environments – Safety Requirements – Part 1: Robot ISO 13849-1 — Safety of Machinery – Safety-Related Parts of Control Systems – Part 1: General Principles for Design American National Standards Institute, 25 West 43rd Street, New York, NY 10036, USA; Telephone: 212.642.4900, Fax: 212.398.0023, http://www.ansi.org European Committee for Standardization, Avenue Marnix 17, B-1000 Brussels; Telephone: 32.2.550.08.11, Fax: 32.2.550.08.19, http://www.cen.eu Deutsches Institut für Normung e.V., Available from Beuth Verlag GmbH, Burggrafenstrasse 4-10, D-10787 Berlin, Germany;

http://www.din.de

International Electrotechnical Commission, 3 rue de Varembé, Case Postale 131, CH-1211 Geneva 20, Switzerland; Telephone:

41.22.919.02.11, Fax: 41.22.919.03.00, http://www.iec.ch International Organization for Standardization, ISO Central Secretariat, 1 rue de Varembé, Case postale 56, CH-1211 Geneva 20, Switzerland;

Telephone: 41.22.749.01.11, Fax: 41.22.733.34.30, http://www.iso.ch

–  –  –

4.7 NFPA Standards6

LETTER (YELLOW) BALLOT

NFPA 12 — Standard on Carbon Dioxide Extinguishing Systems NFPA 13 — Standard for Installation of Sprinkler Systems NFPA 72 — National Fire Alarm Code NFPA 497 — Recommended Practice for the Classification of Flammable Liquids, Gases, or Vapors and of Hazardous (Classified) Locations for Electrical Installations in Chemical Process Areas NFPA 704 — Standard System for the Identification of the Hazards of Materials for Emergency Response NFPA 2001 — Standard on Clean Agent Fire Extinguishing Systems

4.8 Underwriters Laboratories Standard7 UL 508A — Industrial Control Panel

4.9 US Code of Federal Regulations8 21 CFR Parts 1000-1050 — Food and Drug Administration/Center for Devices and Radiological Health (FDA/CDRH), Performance Standards for Electronic Products, Title 21 Code of Federal Regulations, Parts 1000Other Standards and Documents ACGIH, Industrial Ventilation Manual9 ASHRAE Standard 110 — Method of Testing Performance of Laboratory Fume Hoods10 Burton, D.J., Semiconductor Exhaust Ventilation Guidebook11 Uniform Building Code™ (UBC)12 Uniform Fire Code™13 NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

5 Terminology NOTICE: Revisions to § 5 will be effective upon the July 2012 publication as shown in Delayed Revisions Sections 4 and 5. The global Environmental Health & Safety Technical Committee has voted that the revisions are OPTIONAL before the Effective Date.

5.1 Abbreviations and Acronyms 5.1.1 ACGIH® — American Conference of Governmental Industrial Hygienists (ACGIH is a registered trademark of the American Conference of Governmental Industrial Hygienists.) 5.1.2 ASHRAE — American Society of Heating, Refrigeration, and Air Conditioning Engineers 5.1.3 MPE — maximum permissible exposure 5.1.4 NOHD — nominal ocular hazard distance National Fire Protection Association, 1 Batterymarch Park, Quincy, MA 02269, USA; Telephone: 617.770.3000, Fax: 617.770.0700, http://www.nfpa.org Underwriters Laboratory, 2600 N.W. Lake Road, Camas, WA 98607-8542, USA; Telephone: 877.854.3577, Fax: 360.817.6278, http://www.ul.com United States Food and Drug Administration/ Center for Devices and Radiological Health (FDA/CDRH). Available from FDA/CDRH;

http://www.accessdata.fda.gov/scripts/cdrh/cfdocs/cfcfr/cfrsearch.cfm ACGIH, 1330 Kemper Meadow Road, Cincinnati, OH 45240, USA. http://www.acgih.org ASHRAE, 1791 Tullie Circle, NE, Atlanta, GE 30329, USA. http://www.ashrae.org IVE, Inc., 2974 South Oakwood, Bountiful, UT 84010, USA. http://www.eburton.com International Conference of Building Officials, 5360 Workman Mill Road, Whittier, CA 90601-2298, USA. http://www.icbo.org International Fire Code Institute, 5360 Workman Mill Road, Whittier, CA 90601-2298, USA. http://www.ifci.org

–  –  –

5.2 Definitions

LETTER (YELLOW) BALLOT

NOTE 1: Composite reports using portions of reports based upon earlier versions of SEMI S2 and SEMI S10 may require understanding of the SEMI S2-0703 or SEMI S10-1296 definitions for the terms hazard, likelihood, mishap, severity, and risk.

5.2.1 abort switch — a switch that, when activated, interrupts the activation sequence of a fire detection or fire suppression system.



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